MC14001BD
vs
MC14001BDR2
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
MOTOROLA INC
Package Description
SOP, SOP14,.25
SOP, SOP14,.25
Reach Compliance Code
unknown
unknown
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
JESD-609 Code
e0
e0
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
NOR GATE
NOR GATE
Max I(ol)
0.0042 A
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP14,.25
SOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Power Supplies
5/15 V
Prop. Delay@Nom-Sup
250 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Base Number Matches
4
4
Part Package Code
SOIC
Pin Count
14
HTS Code
8542.39.00.01
Family
4000/14000/40000
Length
8.65 mm
Number of Functions
4
Number of Inputs
2
Packing Method
TR
Propagation Delay (tpd)
250 ns
Seated Height-Max
1.75 mm
Supply Voltage-Max (Vsup)
18 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
5 V
Width
3.9 mm
Compare MC14001BDR2 with alternatives