MC14001BALDS vs HD14001BP feature comparison

MC14001BALDS Motorola Mobility LLC

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HD14001BP Renesas Electronics Corporation

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer MOTOROLA INC RENESAS ELECTRONICS CORP
Part Package Code DIP DIP
Package Description DIP, DIP14,.3 DIP,
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T14 R-PDIP-T14
JESD-609 Code e0
Length 19.495 mm 19.2 mm
Load Capacitance (CL) 50 pF
Logic IC Type NOR GATE NOR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 250 ns 250 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Seated Height-Max 5.08 mm 5.06 mm
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 3 2

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