MC1210P-1181-FB101
vs
CAS14F1181CT
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
RCD COMPONENTS INC
|
CAL-CHIP ELECTRONICS INC
|
Package Description |
CHIP
|
CHIP
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8533.21.00.30
|
8533.21.00.30
|
Additional Feature |
PRECISION
|
ANTI-SULFUR
|
Construction |
Chip
|
Rectangular
|
Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
155 °C
|
155 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Height |
0.6 mm
|
0.55 mm
|
Package Length |
3.2 mm
|
3.1 mm
|
Package Shape |
RECTANGULAR PACKAGE
|
|
Package Style |
SMT
|
SMT
|
Package Width |
2.5 mm
|
2.6 mm
|
Packing Method |
BULK
|
TR, Paper, 7 Inch
|
Rated Power Dissipation (P) |
0.33 W
|
0.33 W
|
Resistance |
1180 Ω
|
1180 Ω
|
Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
Size Code |
1210
|
1210
|
Surface Mount |
YES
|
YES
|
Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
Temperature Coefficient |
100 ppm/°C
|
100 ppm/°C
|
Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
Tolerance |
1%
|
1%
|
Working Voltage |
200 V
|
200 V
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
JESD-609 Code |
|
e3
|
Rated Temperature |
|
70 °C
|
Reference Standard |
|
AEC-Q200
|
Terminal Finish |
|
TIN OVER NICKEL
|
|
|
|
Compare MC1210P-1181-FB101 with alternatives
Compare CAS14F1181CT with alternatives