MC1206S4F5622T5E
vs
RM12F5622CTDK
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MULTICOMP PRO
CAL-CHIP ELECTRONICS INC
Package Description
CHIP
CHIP
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.30
8533.21.00.30
Samacsys Manufacturer
Multicomp Pro
Construction
Rectangular
Rectangular
JESD-609 Code
e3
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.55 mm
0.55 mm
Package Length
3.1 mm
3.1 mm
Package Shape
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
1.55 mm
1.55 mm
Packing Method
TR
TR, PAPER, 7 INCH
Rated Power Dissipation (P)
0.25 W
0.25 W
Rated Temperature
70 °C
70 °C
Resistance
56200 Ω
56200 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
1206
1206
Surface Mount
YES
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
100 ppm/°C
100 ppm/°C
Terminal Finish
Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
1%
1%
Working Voltage
200 V
200 V
Base Number Matches
1
1
Compare MC1206S4F5622T5E with alternatives
Compare RM12F5622CTDK with alternatives