MC1206P-8061-FBQ vs MR12X8061FGL feature comparison

MC1206P-8061-FBQ RCD Components Inc

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MR12X8061FGL Walsin Technology Corporation

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Rohs Code No Yes
Part Life Cycle Code Active Active
Ihs Manufacturer RCD COMPONENTS INC WALSIN TECHNOLOGY CORP
Reach Compliance Code compliant compliant
ECCN Code EAR99
Construction Chip Rectangular
JESD-609 Code e0 e3
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.61 mm 0.6 mm
Package Length 3.2 mm 3.1 mm
Package Style SMT SMT
Package Width 1.55 mm 1.6 mm
Packing Method Bulk TR, PAPER, 13 INCH
Rated Power Dissipation (P) 0.25 W 0.25 W
Resistance 8060 Ω 8060 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish TIN LEAD OVER NICKEL TIN
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Package Description CHIP
Additional Feature ANTI-SULFUR, LASER TRIMMABLE, RATED AC VOLTAGE (V): 200
Mounting Feature SURFACE MOUNT
Rated Temperature 70 °C
Reference Standard AEC-Q200; MIL-STD-202
Surface Mount YES
Terminal Shape WRAPAROUND

Compare MC1206P-8061-FBQ with alternatives

Compare MR12X8061FGL with alternatives