MC1206P-755-JBW
vs
RK73B2BLTEB755J
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
RCD COMPONENTS INC
|
KOA SPEER ELECTRONICS INC
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Construction |
Chip
|
Chip
|
| JESD-609 Code |
e3
|
e0
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
155 °C
|
155 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.61 mm
|
0.6 mm
|
| Package Length |
3.2 mm
|
3.2 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
1.55 mm
|
1.6 mm
|
| Packing Method |
Bulk
|
TR, EMBOSSED PLASTIC, 13 INCH
|
| Rated Power Dissipation (P) |
0.25 W
|
0.25 W
|
| Resistance |
7500000 Ω
|
7500000 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Size Code |
1206
|
1206
|
| Surface Mount |
YES
|
YES
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
400 ppm/°C
|
400 ppm/°C
|
| Terminal Finish |
MATTE TIN OVER NICKEL
|
Tin/Lead (Sn90Pb10) - with Nickel (Ni) barrier
|
| Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
| Tolerance |
5%
|
5%
|
| Working Voltage |
200 V
|
200 V
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
CHIP
|
| HTS Code |
|
8533.21.00.30
|
| Package Shape |
|
RECTANGULAR PACKAGE
|
| Rated Temperature |
|
70 °C
|
| Reference Standard |
|
AEC-Q200
|
|
|
|
Compare MC1206P-755-JBW with alternatives
Compare RK73B2BLTEB755J with alternatives