MC1206P-330-JTW vs RK73B2BTTDB330J feature comparison

MC1206P-330-JTW RCD Components Inc

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RK73B2BTTDB330J KOA Speer Electronics Inc

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer RCD COMPONENTS INC KOA SPEER ELECTRONICS INC
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
Construction Chip Chip
JESD-609 Code e3 e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.61 mm 0.6 mm
Package Length 3.2 mm 3.2 mm
Package Style SMT SMT
Package Width 1.55 mm 1.6 mm
Packing Method TR TR, PUNCHED PAPER, 13 INCH
Rated Power Dissipation (P) 0.25 W 0.25 W
Resistance 33 Ω 33 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 200 ppm/°C 200 ppm/°C
Terminal Finish MATTE TIN OVER NICKEL MATTE TIN OVER NICKEL
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 5% 5%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Pbfree Code Yes
Package Description CHIP, ROHS COMPLIANT
HTS Code 8533.21.00.30
Package Shape RECTANGULAR PACKAGE
Rated Temperature 70 °C
Reference Standard AEC-Q200

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