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MC1206P-17R8-FB101 vs MC1206L6F17R8SE feature comparison

MC1206P-17R8-FB101 RCD Components Inc

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MC1206L6F17R8SE SPC Multicomp

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Part Life Cycle Code Active Active
Ihs Manufacturer RCD COMPONENTS INC SPC TECHNOLOGY/ MULTICOMP
Package Description CHIP
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30
Additional Feature PRECISION
Construction Chip Multilayer Chip
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.61 mm 0.55 mm
Package Length 3.2 mm 3.1 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 1.55 mm 1.55 mm
Packing Method BULK TR, Paper
Rated Power Dissipation (P) 0.25 W 0.25 W
Resistance 17.8 Ω 17.8 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Shape WRAPAROUND
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Rohs Code Yes
Resistors » Metal Glaze/Thick Film Resistors
Resistors » Metal Glaze/Thick Film Resistors

Compare MC1206P-17R8-FB101 with alternatives

Compare MC1206L6F17R8SE with alternatives