MC1206L6F1R33SE vs RK73H2BLTEB1R33F feature comparison

MC1206L6F1R33SE SPC Multicomp

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RK73H2BLTEB1R33F KOA Speer Electronics Inc

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Yes No
Active Active
SPC TECHNOLOGY/ MULTICOMP KOA SPEER ELECTRONICS INC
unknown not_compliant
EAR99 EAR99
Multilayer Chip Chip
2 2
155 °C 155 °C
-55 °C -55 °C
0.55 mm 0.6 mm
3.1 mm 3.2 mm
SMT SMT
1.55 mm 1.6 mm
TR, Paper TR, 13 Inch
0.25 W 0.25 W
1.33 Ω 1.33 Ω
FIXED RESISTOR FIXED RESISTOR
1206 1206
METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
200 ppm/°C 200 ppm/°C
1% 1%
200 V 200 V
1 1
e0
Tin/Lead (Sn90Pb10) - with Nickel (Ni) barrier

Compare MC1206L6F1R33SE with alternatives

Compare RK73H2BLTEB1R33F with alternatives