MC10H209FNR2
vs
MC10H209FNR2G
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
ON SEMICONDUCTOR
Package Description
QCCJ, LDCC20,.4SQ
LEAD FREE, PLASTIC, LCC-20
Reach Compliance Code
unknown
unknown
JESD-30 Code
S-PQCC-J20
S-PQCC-J20
JESD-609 Code
e0
e3
Number of Terminals
20
20
Operating Temperature-Max
70 °C
75 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Equivalence Code
LDCC20,.4SQ
LDCC20,.4SQ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Packing Method
TAPE AND REEL
TR
Power Supply Current-Max (ICC)
30 mA
30 mA
Prop. Delay@Nom-Sup
1.15 ns
1.15 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Surface Mount
YES
YES
Technology
ECL
ECL
Temperature Grade
COMMERCIAL
COMMERCIAL EXTENDED
Terminal Finish
Tin/Lead (Sn/Pb)
TIN
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Base Number Matches
4
1
Part Package Code
QLCC
Pin Count
20
HTS Code
8542.39.00.01
Additional Feature
ASYMMETRICAL INPUTS
Family
10H
Length
8.965 mm
Logic IC Type
OR/NOR GATE
Moisture Sensitivity Level
3
Number of Functions
2
Number of Inputs
5
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
1.15 ns
Seated Height-Max
4.57 mm
Supply Voltage-Max (Vsup)
-5.46 V
Supply Voltage-Min (Vsup)
-4.94 V
Supply Voltage-Nom (Vsup)
-5.2 V
Time@Peak Reflow Temperature-Max (s)
30
Width
8.965 mm
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