MC10H186P
vs
MC10H130FN
feature comparison
| Pbfree Code |
No
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Part Package Code |
DIP
|
|
| Package Description |
PLASTIC, DIP-16
|
QCCJ, LDCC20,.4SQ
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| Additional Feature |
RESET ACTIVE ONLY WHEN CLOCK IS LOW
|
|
| Family |
10H
|
|
| JESD-30 Code |
R-PDIP-T16
|
S-PQCC-J20
|
| JESD-609 Code |
e0
|
e0
|
| Length |
19.175 mm
|
|
| Logic IC Type |
D FLIP-FLOP
|
D LATCH
|
| Moisture Sensitivity Level |
NOT SPECIFIED
|
|
| Number of Bits |
6
|
1
|
| Number of Functions |
1
|
2
|
| Number of Terminals |
16
|
20
|
| Operating Temperature-Max |
75 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Characteristics |
OPEN-EMITTER
|
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
QCCJ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Propagation Delay (tpd) |
3 ns
|
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Seated Height-Max |
4.44 mm
|
|
| Surface Mount |
NO
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
J BEND
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Trigger Type |
POSITIVE EDGE
|
|
| Width |
7.62 mm
|
|
| fmax-Min |
250 MHz
|
|
| Base Number Matches |
5
|
4
|
| Rohs Code |
|
No
|
| Package Equivalence Code |
|
LDCC20,.4SQ
|
| Prop. Delay@Nom-Sup |
|
1.9 ns
|
|
|
|