MC10H176FNR2G
vs
10H535/BEAJC
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ON SEMICONDUCTOR
|
MOTOROLA INC
|
| Part Package Code |
QLCC
|
DIP
|
| Package Description |
QCCJ, LDCC20,.4SQ
|
DIP, DIP16,.3
|
| Pin Count |
20
|
16
|
| Manufacturer Package Code |
775-02
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
onsemi
|
|
| Family |
10H
|
10H
|
| JESD-30 Code |
S-PQCC-J20
|
R-GDIP-T16
|
| JESD-609 Code |
e3
|
e0
|
| Length |
8.965 mm
|
19.495 mm
|
| Logic IC Type |
D FLIP-FLOP
|
JBAR-KBAR FLIP-FLOP
|
| Max Frequency@Nom-Sup |
250000000 Hz
|
250000000 Hz
|
| Number of Bits |
6
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
16
|
| Operating Temperature-Max |
75 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Characteristics |
OPEN-EMITTER
|
OPEN-EMITTER
|
| Output Polarity |
TRUE
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
QCCJ
|
DIP
|
| Package Equivalence Code |
LDCC20,.4SQ
|
DIP16,.3
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Power Supply Current-Max (ICC) |
123 mA
|
75 mA
|
| Propagation Delay (tpd) |
2.2 ns
|
2.6 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
5.08 mm
|
| Surface Mount |
YES
|
NO
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
MILITARY
|
| Terminal Finish |
TIN
|
TIN LEAD
|
| Terminal Form |
J BEND
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
8.965 mm
|
7.62 mm
|
| fmax-Min |
250 MHz
|
250 MHz
|
| Base Number Matches |
1
|
3
|
| Screening Level |
|
38535Q/M;38534H;883B
|
|
|
|
Compare MC10H176FNR2G with alternatives
Compare 10H535/BEAJC with alternatives