MC10H176FN
vs
MC10175L
feature comparison
| Pbfree Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Part Package Code |
QLCC
|
|
| Package Description |
PLASTIC, LCC-20
|
DIP, DIP16,.3
|
| Pin Count |
20
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| Family |
10H
|
|
| JESD-30 Code |
S-PQCC-J20
|
R-XDIP-T16
|
| JESD-609 Code |
e0
|
e0
|
| Length |
8.965 mm
|
|
| Logic IC Type |
D FLIP-FLOP
|
D LATCH
|
| Moisture Sensitivity Level |
NOT SPECIFIED
|
|
| Number of Bits |
6
|
5
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
16
|
| Operating Temperature-Max |
75 °C
|
85 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Characteristics |
OPEN-EMITTER
|
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC
|
| Package Code |
QCCJ
|
DIP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Propagation Delay (tpd) |
2.2 ns
|
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
|
| Surface Mount |
YES
|
NO
|
| Technology |
ECL
|
ECL10K
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
OTHER
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
J BEND
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Trigger Type |
POSITIVE EDGE
|
|
| Width |
8.965 mm
|
|
| fmax-Min |
250 MHz
|
|
| Base Number Matches |
5
|
5
|
| Rohs Code |
|
No
|
| Package Equivalence Code |
|
DIP16,.3
|
| Power Supplies |
|
-5.2 V
|
| Power Supply Current-Max (ICC) |
|
107 mA
|
|
|
|