MC10H174MG
vs
MC10158P
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ONSEMI
|
ONSEMI
|
Part Package Code |
SOIC
|
DIP
|
Package Description |
LEAD FREE, EIAJ, SO-16
|
DIP-16
|
Pin Count |
16
|
16
|
Reach Compliance Code |
unknown
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
4 Weeks
|
Family |
10H
|
10K
|
JESD-30 Code |
R-PDSO-G16
|
R-PDIP-T16
|
JESD-609 Code |
e4
|
e0
|
Length |
10.2 mm
|
19.175 mm
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
Number of Functions |
2
|
4
|
Number of Inputs |
4
|
2
|
Number of Outputs |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
75 °C
|
85 °C
|
Operating Temperature-Min |
|
-30 °C
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
DIP
|
Package Equivalence Code |
SOP16,.3
|
DIP16,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
IN-LINE
|
Packing Method |
RAIL
|
|
Peak Reflow Temperature (Cel) |
260
|
235
|
Power Supply Current-Max (ICC) |
80 mA
|
53 mA
|
Prop. Delay@Nom-Sup |
3.2 ns
|
4.8 ns
|
Propagation Delay (tpd) |
2.5 ns
|
3 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.05 mm
|
4.44 mm
|
Surface Mount |
YES
|
NO
|
Technology |
ECL
|
ECL
|
Temperature Grade |
COMMERCIAL EXTENDED
|
OTHER
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN LEAD
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
5.275 mm
|
7.62 mm
|
Base Number Matches |
1
|
1
|
Samacsys Manufacturer |
|
onsemi
|
Output Characteristics |
|
OPEN-EMITTER
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MC10H174MG with alternatives
Compare MC10158P with alternatives