MC10H174MELG vs 5962-8756601EX feature comparison

MC10H174MELG onsemi

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5962-8756601EX QP Semiconductor

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Rohs Code Yes
Part Life Cycle Code Obsolete Transferred
parentfamilyid 1036715
Ihs Manufacturer ONSEMI QP SEMICONDUCTOR INC
Part Package Code SOIC DIP
Package Description LEAD FREE, EIAJ, SO-16 DIP,
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.6 12.6
Average Weight (mg) 162.05 1187.4
CO2e (mg) 2041.83 14961.241
Total Weight 227.6
Category CO2 Kg 12.6 12.6
CO2 2867.7599999999998
Compliance Temperature Grade Commercial Extended: +0C to +75C Military: -55C to +125C
EU RoHS Version RoHS 2 (2015/863/EU)
CAS Accounted for Wt 92
CA Prop 65 Presence YES
CA Prop 65 CAS Numbers 7440-02-0
EFUP e
Conflict Mineral Status DRC Conflict Free Undeterminable
Conflict Mineral Status Source Conflict Minerals Statement
Family 10H 10H
JESD-30 Code R-PDSO-G16 R-GDIP-T16
JESD-609 Code e4
Length 10.2 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 2 4
Number of Inputs 4 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 75 °C 125 °C
Operating Temperature-Min -55 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SOP DIP
Package Equivalence Code SOP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 80 mA
Prop. Delay@Nom-Sup 3.2 ns
Propagation Delay (tpd) 2.5 ns 3 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.05 mm
Surface Mount YES NO
Technology ECL ECL
Temperature Grade COMMERCIAL EXTENDED MILITARY
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm
Terminal Position DUAL DUAL
Width 5.275 mm
Base Number Matches 2 4

Compare MC10H174MELG with alternatives

Compare 5962-8756601EX with alternatives