MC10H166L
vs
MC10H181FNR2
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
MOTOROLA INC
|
| Part Package Code |
DIP
|
QLCC
|
| Package Description |
DIP,
|
QCCJ,
|
| Pin Count |
16
|
28
|
| Reach Compliance Code |
unknown
|
unknown
|
| Additional Feature |
TWO OUTPUT PROVIDES: A < B; A > B AND A = B FUNCTIONS
|
CAPABLE OF 16 LOGIC & ARITHMETIC OPERATIONS; INTERNAL RIPPLE CARRY; HIGHER ORDER LOOKAHEAD
|
| Family |
10H
|
10H
|
| JESD-30 Code |
R-GDIP-T16
|
S-PQCC-J28
|
| JESD-609 Code |
e0
|
|
| Length |
19.49 mm
|
11.505 mm
|
| Logic IC Type |
MAGNITUDE COMPARATOR
|
ARITHMETIC LOGIC UNIT
|
| Number of Bits |
5
|
4
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
28
|
| Operating Temperature-Max |
75 °C
|
75 °C
|
| Operating Temperature-Min |
|
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
QCCJ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
235
|
|
| Propagation Delay (tpd) |
3.7 ns
|
4.3 ns
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
4.57 mm
|
| Surface Mount |
NO
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
J BEND
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
7.62 mm
|
11.505 mm
|
| Base Number Matches |
5
|
3
|
| HTS Code |
|
8542.39.00.01
|
| Output Characteristics |
|
OPEN-EMITTER
|
| Power Supply Current-Max (ICC) |
|
159 mA
|
|
|
|
Compare MC10H181FNR2 with alternatives