MC10H158FNR2
vs
5962-8772901XA
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
MICROSS COMPONENTS
|
| Package Description |
QCCJ, LDCC20,.4SQ
|
DFP, FL16,.3
|
| Reach Compliance Code |
unknown
|
compliant
|
| JESD-30 Code |
S-PQCC-J20
|
R-CDFP-F16
|
| JESD-609 Code |
e0
|
e0
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Number of Functions |
4
|
1
|
| Number of Inputs |
2
|
8
|
| Number of Terminals |
20
|
16
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QCCJ
|
DFP
|
| Package Equivalence Code |
LDCC20,.4SQ
|
FL16,.3
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
FLATPACK
|
| Packing Method |
TAPE AND REEL
|
|
| Power Supply Current-Max (ICC) |
53 mA
|
83 mA
|
| Prop. Delay@Nom-Sup |
2.9 ns
|
3.4 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
J BEND
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Base Number Matches |
5
|
1
|
| Part Package Code |
|
DFP
|
| Pin Count |
|
16
|
| HTS Code |
|
8542.39.00.01
|
| Family |
|
10H
|
| Length |
|
10.16 mm
|
| Number of Outputs |
|
1
|
| Output Characteristics |
|
OPEN-EMITTER
|
| Output Polarity |
|
INVERTED
|
| Propagation Delay (tpd) |
|
3.4 ns
|
| Screening Level |
|
MIL-STD-883
|
| Seated Height-Max |
|
2.16 mm
|
| Supply Voltage-Max (Vsup) |
|
2.02 V
|
| Supply Voltage-Min (Vsup) |
|
1.98 V
|
| Supply Voltage-Nom (Vsup) |
|
2 V
|
| Width |
|
6.86 mm
|
|
|
|
Compare 5962-8772901XA with alternatives