MC10H158FN
vs
MC10H158MG
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
ONSEMI
|
| Package Description |
QCCJ, LDCC20,.4SQ
|
LEAD FREE, EIAJ, SO-16
|
| Reach Compliance Code |
unknown
|
unknown
|
| JESD-30 Code |
S-PQCC-J20
|
R-PDSO-G16
|
| JESD-609 Code |
e0
|
e4
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
20
|
16
|
| Operating Temperature-Max |
70 °C
|
75 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
SOP
|
| Package Equivalence Code |
LDCC20,.4SQ
|
SOP16,.3
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE
|
| Power Supply Current-Max (ICC) |
53 mA
|
53 mA
|
| Prop. Delay@Nom-Sup |
2.9 ns
|
2.9 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
J BEND
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Base Number Matches |
5
|
2
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
16
|
| HTS Code |
|
8542.39.00.01
|
| Factory Lead Time |
|
4 Weeks
|
| Family |
|
10H
|
| Length |
|
10.2 mm
|
| Number of Outputs |
|
1
|
| Output Polarity |
|
TRUE
|
| Packing Method |
|
RAIL
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Propagation Delay (tpd) |
|
1.9 ns
|
| Seated Height-Max |
|
2.05 mm
|
| Width |
|
5.275 mm
|
|
|
|
Compare MC10H158MG with alternatives