MC10H136FNG
vs
MC10H136FNR2G
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
ONSEMI
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
QLCC
|
QLCC
|
| Package Description |
LEAD FREE, PLASTIC, LCC-20
|
LEAD FREE, PLASTIC, LCC-20
|
| Pin Count |
20
|
20
|
| Manufacturer Package Code |
775-02
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
4 Weeks
|
|
| Count Direction |
BIDIRECTIONAL
|
BIDIRECTIONAL
|
| Family |
10H
|
10H
|
| JESD-30 Code |
S-PQCC-J20
|
S-PQCC-J20
|
| JESD-609 Code |
e3
|
e3
|
| Length |
8.965 mm
|
8.965 mm
|
| Load/Preset Input |
YES
|
YES
|
| Logic IC Type |
BINARY COUNTER
|
BINARY COUNTER
|
| Max Frequency@Nom-Sup |
250000000 Hz
|
|
| Mode of Operation |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Moisture Sensitivity Level |
3
|
NOT SPECIFIED
|
| Number of Bits |
4
|
4
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
75 °C
|
75 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Equivalence Code |
LDCC20,.4SQ
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Power Supply Current-Max (ICC) |
165 mA
|
|
| Propagation Delay (tpd) |
2.4 ns
|
2.4 ns
|
| Qualification Status |
Not Qualified
|
COMMERCIAL
|
| Seated Height-Max |
4.57 mm
|
4.57 mm
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
TIN
|
MATTE TIN
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
8.965 mm
|
8.965 mm
|
| Base Number Matches |
2
|
2
|
| fmax-Min |
|
250 MHz
|
|
|
|
Compare MC10H136FNG with alternatives