MC10H135FN
vs
MC10231FNR2
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MOTOROLA INC
ON SEMICONDUCTOR
Package Description
PLASTIC, LCC-20
PLASTIC, LCC-20
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
WITH INDIVIDUAL SET AND RESET INPUTS
Family
10H
10K
JESD-30 Code
S-PQCC-J20
S-PQCC-J20
JESD-609 Code
e0
e0
Length
8.9662 mm
8.965 mm
Logic IC Type
JBAR-KBAR FLIP-FLOP
D FLIP-FLOP
Max Frequency@Nom-Sup
250000000 Hz
200000000 Hz
Number of Bits
2
1
Number of Functions
1
2
Number of Terminals
20
20
Operating Temperature-Max
75 °C
85 °C
Operating Temperature-Min
-30 °C
Output Characteristics
OPEN-EMITTER
OPEN-EMITTER
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Equivalence Code
LDCC20,.4SQ
LDCC20,.4SQ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Power Supply Current-Max (ICC)
75 mA
72 mA
Propagation Delay (tpd)
2.6 ns
3.3 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.57 mm
4.57 mm
Surface Mount
YES
YES
Technology
ECL
ECL
Temperature Grade
COMMERCIAL EXTENDED
OTHER
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn80Pb20)
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
8.9662 mm
8.965 mm
fmax-Min
250 MHz
200 MHz
Base Number Matches
5
3
Part Package Code
QLCC
Pin Count
20
Moisture Sensitivity Level
1
Packing Method
TR
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