MC10H135FN
vs
M38510/06102BFA
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
MOTOROLA INC
|
| Package Description |
QCCJ, LDCC20,.4SQ
|
DFP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| JESD-30 Code |
S-PQCC-J20
|
R-GDFP-F16
|
| JESD-609 Code |
e0
|
e0
|
| Logic IC Type |
J-K FLIP-FLOP
|
D FLIP-FLOP
|
| Max Frequency@Nom-Sup |
250000000 Hz
|
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
20
|
16
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
QCCJ
|
DFP
|
| Package Equivalence Code |
LDCC20,.4SQ
|
FL16,.3
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
FLATPACK
|
| Power Supply Current-Max (ICC) |
75 mA
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
J BEND
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
QUAD
|
DUAL
|
| Trigger Type |
MASTER-SLAVE
|
POSITIVE EDGE
|
| Base Number Matches |
5
|
7
|
| Part Package Code |
|
DFP
|
| Pin Count |
|
16
|
| HTS Code |
|
8542.39.00.01
|
| Family |
|
10K
|
| Number of Bits |
|
1
|
| Output Polarity |
|
COMPLEMENTARY
|
| Propagation Delay (tpd) |
|
3.9 ns
|
| fmax-Min |
|
200 MHz
|
|
|
|
Compare M38510/06102BFA with alternatives