MC10H130FN
vs
10H531/BFAJC
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ON SEMICONDUCTOR
|
MOTOROLA INC
|
| Part Package Code |
QFN
|
DFP
|
| Package Description |
PLASTIC, LLC-20
|
DFP, FL16,.3
|
| Pin Count |
20
|
16
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
10H
|
10H
|
| JESD-30 Code |
S-PQCC-J20
|
R-GDFP-F16
|
| JESD-609 Code |
e0
|
e0
|
| Length |
8.965 mm
|
9.65 mm
|
| Logic IC Type |
D LATCH
|
D FLIP-FLOP
|
| Number of Bits |
2
|
1
|
| Number of Functions |
1
|
2
|
| Number of Terminals |
20
|
16
|
| Operating Temperature-Max |
75 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Characteristics |
OPEN-EMITTER
|
OPEN-EMITTER
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
QCCJ
|
DFP
|
| Package Equivalence Code |
LDCC20,.4SQ
|
FL16,.3
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
235
|
|
| Prop. Delay@Nom-Sup |
1.9 ns
|
|
| Propagation Delay (tpd) |
1.7 ns
|
2.2 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
2.15 mm
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
J BEND
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Trigger Type |
LOW LEVEL
|
POSITIVE EDGE
|
| Width |
8.965 mm
|
6.415 mm
|
| Base Number Matches |
4
|
1
|
| Additional Feature |
|
WITH ADDITIONAL COMMON CLOCK
|
| Max Frequency@Nom-Sup |
|
250000000 Hz
|
| Power Supply Current-Max (ICC) |
|
62 mA
|
| Screening Level |
|
38535Q/M;38534H;883B
|
| fmax-Min |
|
250 MHz
|
|
|
|
Compare MC10H130FN with alternatives
Compare 10H531/BFAJC with alternatives