MC10H105FNR2
vs
MC10H105FNR2G
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ONSEMI
|
ON SEMICONDUCTOR
|
| Part Package Code |
QLCC
|
QLCC
|
| Package Description |
PLASTIC, LCC-20
|
LEAD FREE, PLASTIC, LCC-20
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Samacsys Manufacturer |
onsemi
|
onsemi
|
| Additional Feature |
ASYMMETRICAL INPUTS
|
ASYMMETRICAL INPUTS
|
| Family |
10H
|
10H
|
| JESD-30 Code |
S-PQCC-J20
|
S-PQCC-J20
|
| JESD-609 Code |
e0
|
e3
|
| Length |
8.965 mm
|
8.965 mm
|
| Logic IC Type |
OR/NOR GATE
|
OR/NOR GATE
|
| Number of Functions |
3
|
3
|
| Number of Inputs |
3
|
3
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
75 °C
|
75 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Equivalence Code |
LDCC20,.4SQ
|
LDCC20,.4SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Packing Method |
TR
|
TR
|
| Peak Reflow Temperature (Cel) |
235
|
260
|
| Power Supply Current-Max (ICC) |
23 mA
|
23 mA
|
| Prop. Delay@Nom-Sup |
1.3 ns
|
1.3 ns
|
| Propagation Delay (tpd) |
1.2 ns
|
1.2 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Schmitt Trigger |
NO
|
NO
|
| Seated Height-Max |
4.57 mm
|
4.57 mm
|
| Supply Voltage-Max (Vsup) |
-5.46 V
|
-5.46 V
|
| Supply Voltage-Min (Vsup) |
-4.94 V
|
-4.94 V
|
| Supply Voltage-Nom (Vsup) |
-5.2 V
|
-5.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
TIN LEAD
|
TIN
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
8.965 mm
|
8.965 mm
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare MC10H105FNR2 with alternatives
Compare MC10H105FNR2G with alternatives