MC10H105FN
vs
MC10H105PG
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ONSEMI
|
ON SEMICONDUCTOR
|
Part Package Code |
QLCC
|
DIP
|
Package Description |
PLASTIC, LCC-20
|
LEAD FREE, PLASTIC, DIP-16
|
Pin Count |
20
|
16
|
Reach Compliance Code |
not_compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
4 Weeks
|
Samacsys Manufacturer |
onsemi
|
onsemi
|
Additional Feature |
ASYMMETRICAL INPUTS
|
ASYMMETRICAL INPUTS
|
Family |
10H
|
10H
|
JESD-30 Code |
S-PQCC-J20
|
R-PDIP-T16
|
JESD-609 Code |
e0
|
e3
|
Length |
8.965 mm
|
19.175 mm
|
Logic IC Type |
OR/NOR GATE
|
OR/NOR GATE
|
Number of Functions |
3
|
3
|
Number of Inputs |
3
|
3
|
Number of Terminals |
20
|
16
|
Operating Temperature-Max |
75 °C
|
75 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
DIP
|
Package Equivalence Code |
LDCC20,.4SQ
|
DIP16,.3
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
IN-LINE
|
Packing Method |
RAIL
|
RAIL
|
Peak Reflow Temperature (Cel) |
235
|
260
|
Power Supply Current-Max (ICC) |
23 mA
|
23 mA
|
Prop. Delay@Nom-Sup |
1.3 ns
|
1.3 ns
|
Propagation Delay (tpd) |
1.2 ns
|
1.2 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Schmitt Trigger |
NO
|
NO
|
Seated Height-Max |
4.57 mm
|
4.44 mm
|
Supply Voltage-Max (Vsup) |
-5.46 V
|
-5.46 V
|
Supply Voltage-Min (Vsup) |
-4.94 V
|
-4.94 V
|
Supply Voltage-Nom (Vsup) |
-5.2 V
|
-5.2 V
|
Surface Mount |
YES
|
NO
|
Technology |
ECL
|
ECL
|
Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
Terminal Finish |
TIN LEAD
|
Tin (Sn)
|
Terminal Form |
J BEND
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
DUAL
|
Width |
8.965 mm
|
7.62 mm
|
Base Number Matches |
4
|
1
|
Pbfree Code |
|
Yes
|
Manufacturer Package Code |
|
648-08
|
|
|
|
Compare MC10H105FN with alternatives
Compare MC10H105PG with alternatives