MC10EP56DTR2
vs
MC100EP56MNG
feature comparison
Pbfree Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
TSSOP
|
QFN
|
Package Description |
TSSOP-20
|
ROHS COMPLIANT, QFN-20
|
Pin Count |
20
|
20
|
Reach Compliance Code |
unknown
|
unknown
|
Additional Feature |
NECL MODE OPERATING RANGE: VCC = 0 V WITH VEE = -3.0 V TO -5.5 V
|
NECL MODE OPERATING RANGE: VCC = 0 V WITH VEE = -3.0 V TO -5.5 V
|
Family |
10E
|
100E
|
JESD-30 Code |
R-PDSO-G20
|
S-XQCC-N20
|
JESD-609 Code |
e4
|
e3
|
Length |
6.5 mm
|
4 mm
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
Moisture Sensitivity Level |
NOT SPECIFIED
|
NOT SPECIFIED
|
Number of Functions |
2
|
2
|
Number of Inputs |
2
|
2
|
Number of Outputs |
1
|
1
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
SERIES-RESISTOR
|
SERIES-RESISTOR
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
TSSOP
|
HVQCCN
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
Propagation Delay (tpd) |
0.47 ns
|
0.47 ns
|
Qualification Status |
COMMERCIAL
|
COMMERCIAL
|
Seated Height-Max |
1.2 mm
|
1 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
ECL
|
ECL
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
MATTE TIN
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
0.65 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
40
|
NOT SPECIFIED
|
Width |
4.4 mm
|
4 mm
|
Base Number Matches |
2
|
2
|
|
|
|