MC10EP51D
vs
MC100LVEL51DR2
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
ONSEMI
|
MOTOROLA INC
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
SOIC-8
|
SOP,
|
Pin Count |
8
|
8
|
Reach Compliance Code |
not_compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
Additional Feature |
NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V
|
WITH DIFFERENTIAL CLOCK
|
Family |
10E
|
100LVEL
|
JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
JESD-609 Code |
e0
|
|
Length |
4.9 mm
|
4.9 mm
|
Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
Max Frequency@Nom-Sup |
3000000000 Hz
|
|
Moisture Sensitivity Level |
1
|
|
Number of Bits |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SOP
|
Package Equivalence Code |
SOP8,.25
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Packing Method |
RAIL
|
|
Peak Reflow Temperature (Cel) |
235
|
|
Power Supply Current-Max (ICC) |
47 mA
|
|
Prop. Delay@Nom-Sup |
0.42 ns
|
|
Propagation Delay (tpd) |
0.37 ns
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
1.75 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
|
Supply Voltage-Min (Vsup) |
3 V
|
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
ECL
|
ECL
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
Width |
3.9 mm
|
3.9 mm
|
Base Number Matches |
1
|
3
|
Output Characteristics |
|
OPEN-EMITTER
|
|
|
|
Compare MC10EP51D with alternatives
Compare MC100LVEL51DR2 with alternatives