MC10EP451MNR4G
vs
MC10E156FNR2G
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
QFN
|
QLCC
|
| Package Description |
HVQCCN,
|
LEAD FREE, PLASTIC, LCC-28
|
| Pin Count |
32
|
28
|
| Reach Compliance Code |
unknown
|
unknown
|
| Additional Feature |
NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V
|
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V
|
| Family |
10E
|
10E
|
| JESD-30 Code |
S-PQCC-N32
|
S-PQCC-J28
|
| JESD-609 Code |
e3
|
e3
|
| Length |
5 mm
|
11.505 mm
|
| Logic IC Type |
D FLIP-FLOP
|
D LATCH
|
| Moisture Sensitivity Level |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Number of Bits |
6
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
28
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
QCCJ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Propagation Delay (tpd) |
0.55 ns
|
0.8 ns
|
| Qualification Status |
COMMERCIAL
|
COMMERCIAL
|
| Seated Height-Max |
1 mm
|
4.57 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.7 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
4.2 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
J BEND
|
| Terminal Pitch |
0.5 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Trigger Type |
POSITIVE EDGE
|
LOW LEVEL
|
| Width |
5 mm
|
11.505 mm
|
| Base Number Matches |
2
|
2
|
| Output Characteristics |
|
OPEN-EMITTER
|
| fmax-Min |
|
700 MHz
|
|
|
|