MC10EP29MNTXG
vs
10E551X
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ON SEMICONDUCTOR
|
MOTOROLA INC
|
Part Package Code |
QFN
|
QFP
|
Package Description |
LEAD FREE, QFN-20
|
QFF,
|
Pin Count |
20
|
28
|
Manufacturer Package Code |
485E-01
|
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V
|
WITH MASTER SLAVE OPERATION; WITH DUAL CLOCK
|
Family |
10E
|
10E
|
JESD-30 Code |
S-XQCC-N20
|
S-PQFP-F28
|
JESD-609 Code |
e3
|
|
Length |
4 mm
|
9.525 mm
|
Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
Moisture Sensitivity Level |
1
|
|
Number of Bits |
1
|
6
|
Number of Functions |
2
|
1
|
Number of Terminals |
20
|
28
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
QFF
|
Package Equivalence Code |
LCC20,.16SQ,20
|
QFL28,.4SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
FLATPACK
|
Packing Method |
TR
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Power Supply Current-Max (ICC) |
60 mA
|
78 mA
|
Propagation Delay (tpd) |
0.5 ns
|
0.85 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1 mm
|
2.03 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
|
Supply Voltage-Min (Vsup) |
3 V
|
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
ECL
|
ECL
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Finish |
TIN
|
|
Terminal Form |
NO LEAD
|
FLAT
|
Terminal Pitch |
0.5 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
Width |
4 mm
|
9.525 mm
|
Base Number Matches |
1
|
2
|
Output Characteristics |
|
OPEN-EMITTER
|
fmax-Min |
|
1100 MHz
|
|
|
|
Compare MC10EP29MNTXG with alternatives
Compare 10E551X with alternatives