MC10EP01D
vs
MC100EP01DR2
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
ON SEMICONDUCTOR
Package Description
SOP, SOP8,.25
SOIC-8
Reach Compliance Code
unknown
not_compliant
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
JESD-609 Code
e0
e0
Logic IC Type
OR/NOR GATE
OR/NOR GATE
Number of Terminals
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP8,.25
SOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Power Supplies
-5.2 V
Power Supply Current-Max (ICC)
29 mA
38 mA
Prop. Delay@Nom-Sup
0.3 ns
0.35 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Surface Mount
YES
YES
Technology
ECL10K
ECL
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Base Number Matches
4
1
Part Package Code
SOIC
Pin Count
8
HTS Code
8542.39.00.01
Additional Feature
NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V
Family
100E
Length
4.9 mm
Moisture Sensitivity Level
1
Number of Functions
1
Number of Inputs
4
Packing Method
TR
Peak Reflow Temperature (Cel)
235
Propagation Delay (tpd)
0.33 ns
Seated Height-Max
1.75 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
3.3 V
Width
3.9 mm
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