MC10EL31DTR2
vs
SY10EP52VKI
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
ON SEMICONDUCTOR
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
SOIC
|
MSOP
|
Package Description |
PLASTIC, TSSOP-8
|
MSOP-8
|
Pin Count |
8
|
8
|
Reach Compliance Code |
not_compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V
|
NECL MODE OPERATING RANGE: VCC=0V, VEE=-3.3V TO -5.5V
|
Family |
10EL
|
10E
|
JESD-30 Code |
S-PDSO-G8
|
S-PDSO-G8
|
JESD-609 Code |
e0
|
|
Length |
3 mm
|
3 mm
|
Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
Max Frequency@Nom-Sup |
2000000000 Hz
|
|
Number of Bits |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Equivalence Code |
TSSOP8,.19
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Packing Method |
TR
|
|
Peak Reflow Temperature (Cel) |
235
|
|
Power Supply Current-Max (ICC) |
32 mA
|
|
Propagation Delay (tpd) |
0.59 ns
|
0.38 ns
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.1 mm
|
1.1 mm
|
Supply Voltage-Max (Vsup) |
5.7 V
|
3.63 V
|
Supply Voltage-Min (Vsup) |
4.2 V
|
2.97 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
ECL
|
ECL
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Trigger Type |
POSITIVE EDGE
|
NEGATIVE EDGE
|
Width |
3 mm
|
3 mm
|
fmax-Min |
2200 MHz
|
4000 MHz
|
Base Number Matches |
1
|
2
|
|
|
|
Compare MC10EL31DTR2 with alternatives
Compare SY10EP52VKI with alternatives