MC10EL12D
vs
MC10EL12DR2
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
ONSEMI
|
MOTOROLA INC
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
SOIC-8
|
SOP, SOP8,.25
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Additional Feature |
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V
|
2 PAIRED OUTPUTS
|
| Family |
10EL
|
10EL
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
| JESD-609 Code |
e0
|
e0
|
| Length |
4.9 mm
|
4.9 mm
|
| Logic IC Type |
OR/NOR GATE
|
OR/NOR GATE
|
| Number of Functions |
1
|
1
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
OPEN-EMITTER
|
OPEN-EMITTER
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP8,.25
|
SOP8,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
235
|
|
| Propagation Delay (tpd) |
0.45 ns
|
0.5 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
5.7 V
|
|
| Supply Voltage-Min (Vsup) |
4.2 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn80Pb20)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3.9 mm
|
3.9 mm
|
| Base Number Matches |
8
|
1
|
| Power Supply Current-Max (ICC) |
|
17 mA
|
|
|
|
Compare MC10EL12D with alternatives
Compare MC10EL12DR2 with alternatives