MC10E457FNR2G
vs
MC10E457FN
feature comparison
| Pbfree Code |
No
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Part Package Code |
QLCC
|
|
| Package Description |
LEAD FREE, PLASTIC, LCC-28
|
QCCJ, LDCC28,.5SQ
|
| Pin Count |
28
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| Additional Feature |
NECL MODE OPERATING RANGE: VEE = -4.2 V TO -5.7 V WITH VCC = 0 V
|
|
| Family |
10E
|
|
| JESD-30 Code |
S-PQCC-J28
|
S-PQCC-J28
|
| JESD-609 Code |
e3
|
e0
|
| Length |
11.505 mm
|
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Moisture Sensitivity Level |
NOT SPECIFIED
|
|
| Number of Functions |
3
|
3
|
| Number of Inputs |
2
|
2
|
| Number of Outputs |
1
|
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Characteristics |
OPEN-EMITTER
|
|
| Output Polarity |
COMPLEMENTARY
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
0.7 ns
|
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
|
| Supply Voltage-Max (Vsup) |
5.7 V
|
|
| Supply Voltage-Min (Vsup) |
4.2 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL10K
|
| Temperature Grade |
OTHER
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
11.505 mm
|
|
| Base Number Matches |
2
|
5
|
| Rohs Code |
|
No
|
| Package Equivalence Code |
|
LDCC28,.5SQ
|
| Power Supplies |
|
-5.2 V
|
| Power Supply Current-Max (ICC) |
|
110 mA
|
| Prop. Delay@Nom-Sup |
|
0.7 ns
|
|
|
|