MC10E1652FNR2G
vs
SY10E193JZ-TR
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
ONSEMI
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
QLCC
|
|
| Pin Count |
20
|
|
| Manufacturer Package Code |
775-02
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Family |
10E
|
10E
|
| JESD-30 Code |
S-PQCC-J20
|
S-PQCC-J28
|
| JESD-609 Code |
e3
|
e3
|
| Length |
8.965 mm
|
11.48 mm
|
| Logic IC Type |
MAGNITUDE COMPARATOR
|
ERROR DETECTION AND CORRECTION CIRCUIT
|
| Moisture Sensitivity Level |
3
|
|
| Number of Bits |
1
|
8
|
| Number of Functions |
2
|
1
|
| Number of Terminals |
20
|
28
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Output Polarity |
COMPLEMENTARY
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
1.075 ns
|
1.15 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
4.57 mm
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
OTHER
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
TIN
|
MATTE TIN
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
8.965 mm
|
11.48 mm
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
LEAD FREE, PLASTIC, LCC-28
|
| Packing Method |
|
TR
|
|
|
|
Compare MC10E1652FNR2G with alternatives
Compare SY10E193JZ-TR with alternatives