MC10E151FNR2
vs
MC10EP31D
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Package Description |
QCCJ, LDCC28,.5SQ
|
SOP, SOP8,.25
|
| Reach Compliance Code |
unknown
|
unknown
|
| JESD-30 Code |
S-PQCC-J28
|
R-PDSO-G8
|
| JESD-609 Code |
e0
|
e0
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Max Frequency@Nom-Sup |
1100000000 Hz
|
2700000000 Hz
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
8
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
SOP
|
| Package Equivalence Code |
LDCC28,.5SQ
|
SOP8,.25
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE
|
| Packing Method |
TAPE AND REEL
|
|
| Power Supplies |
-5.2 V
|
-3.0/-5.5/3.3/5.0 V
|
| Power Supply Current-Max (ICC) |
78 mA
|
47 mA
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL10K
|
ECL10K
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
J BEND
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Trigger Type |
MASTER-SLAVE
|
MASTER-SLAVE
|
| Base Number Matches |
5
|
4
|
|
|
|