MC10E150FN
vs
MC10EP31D
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
MOTOROLA INC
Package Description
QCCJ, LDCC28,.5SQ
SOP, SOP8,.25
Reach Compliance Code
unknown
unknown
JESD-30 Code
S-PQCC-J28
R-PDSO-G8
JESD-609 Code
e0
e0
Logic IC Type
D LATCH
D FLIP-FLOP
Number of Bits
6
1
Number of Functions
1
1
Number of Terminals
28
8
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
SOP
Package Equivalence Code
LDCC28,.5SQ
SOP8,.25
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER
SMALL OUTLINE
Power Supplies
-5.2 V
Power Supply Current-Max (ICC)
62 mA
47 mA
Prop. Delay@Nom-Sup
0.55 ns
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Technology
ECL10K
ECL
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
J BEND
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
DUAL
Base Number Matches
4
4
Part Package Code
SOIC
Pin Count
8
HTS Code
8542.39.00.01
Family
10E
Length
4.9 mm
Max Frequency@Nom-Sup
2700000000 Hz
Output Characteristics
OPEN-EMITTER
Output Polarity
COMPLEMENTARY
Seated Height-Max
1.75 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
3 V
Trigger Type
POSITIVE EDGE
Width
3.9 mm
fmax-Min
3 MHz
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