MC10197P vs M38510/06202BEB feature comparison

MC10197P Freescale Semiconductor

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M38510/06202BEB Motorola Mobility LLC

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS MOTOROLA INC
Package Description DIP, DIP16,.3 DIP,
Reach Compliance Code unknown unknown
JESD-30 Code R-PDIP-T16 R-XDIP-T16
JESD-609 Code e0 e0
Logic IC Type AND GATE AND GATE
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -30 °C -55 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code DIP DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supply Current-Max (ICC) 54 mA
Prop. Delay@Nom-Sup 5.5 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Surface Mount NO NO
Technology ECL10K ECL
Temperature Grade OTHER MILITARY
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 5 3
Part Package Code DIP
Pin Count 16
HTS Code 8542.39.00.01
Family 10K
Number of Functions 6
Number of Inputs 1
Propagation Delay (tpd) 5.9 ns
Screening Level MIL-M-38510 Class B
Supply Voltage-Max (Vsup) -5.46 V
Supply Voltage-Min (Vsup) -4.94 V
Supply Voltage-Nom (Vsup) -5.2 V

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