MC10181L
vs
MC10H181PW
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ONSEMI
|
MOTOROLA INC
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
CERAMIC, DIP-24
|
DIP, DIP24,.6
|
| Pin Count |
24
|
24
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Family |
10K
|
10H
|
| JESD-30 Code |
R-CDIP-T24
|
R-PDIP-T24
|
| JESD-609 Code |
e0
|
e0
|
| Length |
32.005 mm
|
31.815 mm
|
| Logic IC Type |
ARITHMETIC LOGIC UNIT
|
ARITHMETIC LOGIC UNIT
|
| Number of Bits |
4
|
4
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
85 °C
|
75 °C
|
| Operating Temperature-Min |
-30 °C
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Propagation Delay (tpd) |
11 ns
|
4.3 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.59 mm
|
5.21 mm
|
| Surface Mount |
NO
|
NO
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
OTHER
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
15.24 mm
|
15.24 mm
|
| Base Number Matches |
1
|
1
|
| Additional Feature |
|
CAPABLE OF 16 LOGIC & ARITHMETIC OPERATIONS; INTERNAL RIPPLE CARRY; HIGHER ORDER LOOKAHEAD
|
| Output Characteristics |
|
OPEN-EMITTER
|
| Package Equivalence Code |
|
DIP24,.6
|
| Power Supply Current-Max (ICC) |
|
159 mA
|
|
|
|
Compare MC10181L with alternatives
Compare MC10H181PW with alternatives