MC10175FN
vs
MC10131FNR2
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA INC
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
Part Package Code |
QLCC
|
|
Package Description |
QCCJ, LDCC20,.4SQ
|
QCCJ, LDCC20,.4SQ
|
Pin Count |
20
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
|
Additional Feature |
WITH DUAL LATCH ENABLE; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH
|
|
Family |
10K
|
|
JESD-30 Code |
S-PQCC-J20
|
S-PQCC-J20
|
JESD-609 Code |
e0
|
e0
|
Length |
8.965 mm
|
|
Logic IC Type |
D LATCH
|
D FLIP-FLOP
|
Number of Bits |
5
|
|
Number of Functions |
1
|
2
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-30 °C
|
-30 °C
|
Output Characteristics |
OPEN-EMITTER
|
|
Output Polarity |
TRUE
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Equivalence Code |
LDCC20,.4SQ
|
LDCC20,.4SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Power Supply Current-Max (ICC) |
107 mA
|
62 mA
|
Propagation Delay (tpd) |
4.4 ns
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
|
Surface Mount |
YES
|
YES
|
Technology |
ECL
|
ECL
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Trigger Type |
LOW LEVEL
|
MASTER-SLAVE
|
Width |
8.965 mm
|
|
Base Number Matches |
5
|
5
|
Rohs Code |
|
No
|
Max Frequency@Nom-Sup |
|
125000000 Hz
|
Packing Method |
|
TAPE AND REEL
|
Power Supplies |
|
-5.2 V
|
|
|
|
Compare MC10175FN with alternatives