MC10171P
vs
SN74LS137ND
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ONSEMI
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Part Package Code |
DIP
|
|
| Package Description |
PLASTIC, DIP-16
|
DIP, DIP16,.3
|
| Pin Count |
16
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
4 Weeks
|
|
| Family |
10K
|
|
| Input Conditioning |
STANDARD
|
|
| JESD-30 Code |
R-PDIP-T16
|
R-PDIP-T16
|
| JESD-609 Code |
e0
|
e0
|
| Length |
19.175 mm
|
|
| Logic IC Type |
2-LINE TO 4-LINE DECODER
|
OTHER DECODER/DRIVER
|
| Number of Functions |
2
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-30 °C
|
|
| Output Characteristics |
OPEN-EMITTER
|
|
| Output Polarity |
INVERTED
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
235
|
|
| Power Supply Current-Max (ICC) |
85 mA
|
|
| Prop. Delay@Nom-Sup |
6.4 ns
|
|
| Propagation Delay (tpd) |
6 ns
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
4.44 mm
|
|
| Supply Voltage-Max (Vsup) |
-5.46 V
|
|
| Supply Voltage-Min (Vsup) |
-4.94 V
|
|
| Supply Voltage-Nom (Vsup) |
-5.2 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
ECL
|
TTL
|
| Temperature Grade |
OTHER
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
7.62 mm
|
|
| Base Number Matches |
5
|
3
|
| Power Supplies |
|
5 V
|
|
|
|
Compare MC10171P with alternatives