MC10133L
vs
MC10H131FNR2
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
ON SEMICONDUCTOR
|
| Part Package Code |
DIP
|
QLCC
|
| Package Description |
DIP, DIP16,.3
|
PLASTIC, LCC-20
|
| Pin Count |
16
|
20
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
STROBED OUTPUTS; WITH ADDITIONAL COMMON LATCH ENABLE
|
|
| Family |
10K
|
10H
|
| JESD-30 Code |
R-GDIP-T16
|
S-PQCC-J20
|
| JESD-609 Code |
e0
|
e0
|
| Length |
19.495 mm
|
8.965 mm
|
| Logic IC Type |
D LATCH
|
D FLIP-FLOP
|
| Number of Bits |
2
|
2
|
| Number of Functions |
2
|
1
|
| Number of Terminals |
16
|
20
|
| Operating Temperature-Max |
85 °C
|
75 °C
|
| Operating Temperature-Min |
-30 °C
|
|
| Output Characteristics |
OPEN-EMITTER
|
OPEN-EMITTER
|
| Output Polarity |
TRUE
|
COMPLEMENTARY
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
QCCJ
|
| Package Equivalence Code |
DIP16,.3
|
LDCC20,.4SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Power Supply Current-Max (ICC) |
82 mA
|
62 mA
|
| Prop. Delay@Nom-Sup |
6 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
4.57 mm
|
| Surface Mount |
NO
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
OTHER
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
J BEND
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Trigger Type |
HIGH LEVEL
|
POSITIVE EDGE
|
| Width |
7.62 mm
|
8.965 mm
|
| Base Number Matches |
1
|
2
|
| Max Frequency@Nom-Sup |
|
250000000 Hz
|
| Moisture Sensitivity Level |
|
1
|
| Packing Method |
|
TR
|
| Peak Reflow Temperature (Cel) |
|
235
|
| Propagation Delay (tpd) |
|
1.7 ns
|
| fmax-Min |
|
250 MHz
|
|
|
|
Compare MC10133L with alternatives
Compare MC10H131FNR2 with alternatives