MC10118P vs 10118F feature comparison

MC10118P Motorola Mobility LLC

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10118F NXP Semiconductors

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Pbfree Code No No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Part Package Code DIP
Package Description DIP, DIP16,.3 DIP, DIP16,.3
Pin Count 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature COMMON INPUT
Family 10K 10K
JESD-30 Code R-PDIP-T16 R-GDIP-T16
JESD-609 Code e0 e0
Length 19.175 mm
Logic IC Type OR-AND GATE OR-AND GATE
Number of Functions 2 2
Number of Inputs 6 6
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -30 °C -30 °C
Output Characteristics OPEN-EMITTER OPEN-EMITTER
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supply Current-Max (ICC) 29 mA 26 mA
Prop. Delay@Nom-Sup 3.8 ns 3.9 ns
Propagation Delay (tpd) 3.8 ns 3.9 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 4.44 mm
Surface Mount NO NO
Technology ECL ECL
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 1

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