MC100LVEL30DW
vs
MC100ES6030DWR2
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA INC
|
FREESCALE SEMICONDUCTOR INC
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
SOP, SOP20,.4
|
1.27 MM PITCH, PLASTIC, MS-013AC, SOIC-20
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
100LVEL
|
100E
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G20
|
| JESD-609 Code |
e0
|
e0
|
| Length |
12.8 mm
|
12.8 mm
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Number of Bits |
3
|
1
|
| Number of Functions |
1
|
3
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
OPEN-EMITTER
|
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP20,.4
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Power Supply Current-Max (ICC) |
64 mA
|
|
| Propagation Delay (tpd) |
0.73 ns
|
0.6 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
2.65 mm
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
7.5 mm
|
7.5 mm
|
| fmax-Min |
1000 MHz
|
1200 MHz
|
| Base Number Matches |
5
|
4
|
| Rohs Code |
|
No
|
| Additional Feature |
|
LVECL MODE: VCC = 0V WITH VEE = -3.135V TO -3.8V
|
| Moisture Sensitivity Level |
|
1
|
| Supply Voltage-Max (Vsup) |
|
3.8 V
|
| Supply Voltage-Min (Vsup) |
|
3.135 V
|
| Supply Voltage-Nom (Vsup) |
|
3.3 V
|
|
|
|
Compare MC100LVEL30DW with alternatives
Compare MC100ES6030DWR2 with alternatives