MC100ES8011PEF
vs
MC100E210FNR2
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
MOTOROLA INC
|
| Part Package Code |
SOIC
|
|
| Package Description |
LEAD FREE, MS-012AA, SOIC-8
|
QCCJ,
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
100E
|
100E
|
| Input Conditioning |
DIFFERENTIAL
|
DIFFERENTIAL
|
| JESD-30 Code |
R-PDSO-G8
|
S-PQCC-J28
|
| JESD-609 Code |
e3
|
|
| Length |
4.9 mm
|
11.5062 mm
|
| Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
2
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
8
|
28
|
| Number of True Outputs |
2
|
9
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
QCCJ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
0.94 ns
|
0.75 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Same Edge Skew-Max (tskwd) |
0.02 ns
|
0.075 ns
|
| Seated Height-Max |
1.75 mm
|
4.57 mm
|
| Supply Voltage-Max (Vsup) |
3.465 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
3.135 V
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
3.9 mm
|
11.5062 mm
|
| Base Number Matches |
2
|
3
|
| Package Equivalence Code |
|
LDCC28,.5SQ
|
|
|
|
Compare MC100ES8011PEF with alternatives