MC100ES8011PDR2
vs
MC100ES6130DT
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
MOTOROLA INC
Part Package Code
SOIC
Package Description
SOP, SOP8,.25
TSSOP-16
Pin Count
8
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
100E
100E
Input Conditioning
DIFFERENTIAL
DIFFERENTIAL MUX
JESD-30 Code
R-PDSO-G8
R-PDSO-G16
JESD-609 Code
e0
Length
4.9 mm
5 mm
Logic IC Type
LOW SKEW CLOCK DRIVER
LOW SKEW CLOCK DRIVER
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Inverted Outputs
Number of Terminals
8
16
Number of True Outputs
2
4
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
TSSOP
Package Equivalence Code
SOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
240
Prop. Delay@Nom-Sup
0.94 ns
Propagation Delay (tpd)
0.94 ns
0.45 ns
Qualification Status
Not Qualified
Not Qualified
Same Edge Skew-Max (tskwd)
0.02 ns
0.025 ns
Seated Height-Max
1.75 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.465 V
3.8 V
Supply Voltage-Min (Vsup)
3.135 V
2.375 V
Supply Voltage-Nom (Vsup)
3.3 V
2.5 V
Surface Mount
YES
YES
Technology
ECL
ECL
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
3.9 mm
4.4 mm
Base Number Matches
2
5
fmax-Min
2000 MHz
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