MC100E150FN
vs
SY10E155JC
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
MICREL INC
|
| Package Description |
QCCJ, LDCC28,.5SQ
|
PLASTIC, LCC-28
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| JESD-30 Code |
S-PQCC-J28
|
S-PQCC-J28
|
| JESD-609 Code |
e0
|
e0
|
| Logic IC Type |
D LATCH
|
D LATCH
|
| Number of Bits |
6
|
6
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Equivalence Code |
LDCC28,.5SQ
|
LDCC28,.5SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Power Supplies |
-4.5 V
|
|
| Power Supply Current-Max (ICC) |
72 mA
|
102 mA
|
| Prop. Delay@Nom-Sup |
0.55 ns
|
0.7 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL100K
|
ECL
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn85Pb15)
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Base Number Matches |
5
|
4
|
| Factory Lead Time |
|
4 Weeks
|
| Additional Feature |
|
SIX 2:1 MUX FOLLOWED BY LATCH
|
| Family |
|
10E
|
| Length |
|
11.48 mm
|
| Moisture Sensitivity Level |
|
1
|
| Number of Inputs |
|
2
|
| Output Characteristics |
|
OPEN-EMITTER
|
| Output Polarity |
|
TRUE
|
| Peak Reflow Temperature (Cel) |
|
240
|
| Propagation Delay (tpd) |
|
0.75 ns
|
| Seated Height-Max |
|
4.57 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Trigger Type |
|
LOW LEVEL
|
| Width |
|
11.48 mm
|
|
|
|
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