MC100E112FNR2
vs
SY100E112JI
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
ON SEMICONDUCTOR
|
MICREL INC
|
Part Package Code |
QLCC
|
|
Package Description |
PLASTIC, LCC-28
|
QCCJ, LDCC28,.5SQ
|
Pin Count |
28
|
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
NECL MODE: 0V VCC WITH VEE = -4.2V TO -5.7V
|
|
Family |
100E
|
100E
|
JESD-30 Code |
S-PQCC-J28
|
S-PQCC-J28
|
JESD-609 Code |
e0
|
e0
|
Length |
11.505 mm
|
11.48 mm
|
Logic IC Type |
INVERTER/BUFFER
|
INVERTER/BUFFER
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
4
|
4
|
Number of Inputs |
1
|
1
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Output Characteristics |
OPEN-EMITTER
|
OPEN-EMITTER
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Equivalence Code |
LDCC28,.5SQ
|
LDCC28,.5SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
235
|
240
|
Propagation Delay (tpd) |
0.75 ns
|
0.6 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
4.57 mm
|
Supply Voltage-Max (Vsup) |
5.7 V
|
|
Supply Voltage-Min (Vsup) |
4.2 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
ECL
|
ECL
|
Temperature Grade |
OTHER
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn85Pb15)
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
11.505 mm
|
11.48 mm
|
Base Number Matches |
2
|
2
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MC100E112FNR2 with alternatives
Compare SY100E112JI with alternatives