MC100E104FNR2
vs
SY100E104JY
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MOTOROLA INC
|
MICREL INC
|
Package Description |
QCCJ,
|
LEAD FREE, PLASTIC, LCC-28
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
|
Additional Feature |
O/P'S CASCADED OR/NOR
|
|
Family |
100E
|
100E
|
JESD-30 Code |
S-PQCC-J28
|
S-PQCC-J28
|
Length |
11.505 mm
|
11.48 mm
|
Logic IC Type |
AND/NAND GATE
|
AND/NAND GATE
|
Number of Functions |
5
|
5
|
Number of Inputs |
2
|
2
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Output Characteristics |
OPEN-EMITTER
|
OPEN-EMITTER
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Equivalence Code |
LDCC28,.5SQ
|
LDCC28,.5SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Power Supply Current-Max (ICC) |
53 mA
|
53 mA
|
Propagation Delay (tpd) |
0.6 ns
|
0.6 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
4.57 mm
|
Surface Mount |
YES
|
YES
|
Technology |
ECL
|
ECL
|
Temperature Grade |
OTHER
|
INDUSTRIAL
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
11.505 mm
|
11.48 mm
|
Base Number Matches |
3
|
2
|
Rohs Code |
|
Yes
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
2
|
Peak Reflow Temperature (Cel) |
|
260
|
Prop. Delay@Nom-Sup |
|
1 ns
|
Schmitt Trigger |
|
NO
|
Terminal Finish |
|
Matte Tin (Sn)
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|