MC0805-1103-FBQ vs MCR10ERTF1103 feature comparison

MC0805-1103-FBQ RCD Components Inc

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MCR10ERTF1103 ROHM Semiconductor

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Part Life Cycle Code Active Not Recommended
Ihs Manufacturer RCD COMPONENTS INC ROHM CO LTD
Package Description CHIP CHIP
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30 8533.21.00.30
Construction Rectangular Chip
JESD-609 Code e0 e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.5 mm 0.5 mm
Package Length 2 mm 2 mm
Package Style SMT SMT
Package Width 1.25 mm 1.25 mm
Packing Method Bulk TR, PAPER, 7 INCH
Rated Power Dissipation (P) 0.125 W 0.125 W
Rated Temperature 70 °C 70 °C
Resistance 110000 Ω 110000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0805 0805
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish TIN LEAD OVER NICKEL Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 1% 1%
Working Voltage 150 V 150 V
Base Number Matches 1 1
Rohs Code Yes
Package Shape RECTANGULAR PACKAGE
Reference Standard TS 16949

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Compare MCR10ERTF1103 with alternatives