MC0805-1002-FBQ vs RC2012F1002GS feature comparison

MC0805-1002-FBQ RCD Components Inc

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RC2012F1002GS Samsung Semiconductor

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Part Life Cycle Code Active Active
Ihs Manufacturer RCD COMPONENTS INC SAMSUNG SEMICONDUCTOR INC
Package Description CHIP SMT, 0805
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8533.21.00.30
Construction Rectangular Chip
JESD-609 Code e0 e3
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.5 mm 0.5 mm
Package Length 2 mm 2 mm
Package Style SMT SMT
Package Width 1.25 mm 1.25 mm
Packing Method Bulk Bulk
Rated Power Dissipation (P) 0.125 W 0.125 W
Rated Temperature 70 °C
Resistance 10000 Ω 10000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0805 0805
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C -100,100 ppm/°C
Terminal Finish TIN LEAD OVER NICKEL Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND
Tolerance 1% 1%
Working Voltage 150 V 150 V
Base Number Matches 1 2
Pbfree Code Yes
Rohs Code Yes
Manufacturer Series RC(PRECISION)
Series RC(PRECISION)

Compare MC0805-1002-FBQ with alternatives

Compare RC2012F1002GS with alternatives