MC0603L6F1002SE vs SFR03EZPF1002 feature comparison

MC0603L6F1002SE SPC Multicomp

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SFR03EZPF1002 ROHM Semiconductor

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer SPC TECHNOLOGY/ MULTICOMP ROHM CO LTD
Reach Compliance Code unknown compliant
ECCN Code EAR99
Construction Multilayer Chip Rectangular
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.45 mm 0.45 mm
Package Length 1.6 mm 1.6 mm
Package Style SMT SMT
Package Width 0.8 mm 0.8 mm
Packing Method TR, Paper TR, PAPER, 7 INCH
Rated Power Dissipation (P) 0.1 W 0.1 W
Resistance 10000 Ω 10000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0603 0603
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Tolerance 1% 1%
Working Voltage 50 V 50 V
Base Number Matches 1 1
Package Description CHIP
Factory Lead Time 13 Weeks
Samacsys Manufacturer ROHM Semiconductor
Additional Feature ANTI-SULFUR
JESD-609 Code e3
Mounting Feature SURFACE MOUNT
Package Shape RECTANGULAR PACKAGE
Rated Temperature 70 °C
Reference Standard AEC-Q200; IATF 16949
Surface Mount YES
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND

Compare MC0603L6F1002SE with alternatives

Compare SFR03EZPF1002 with alternatives